COB (Chip on Board) is not a new packaging technology in the semiconductor industry. COB MCPCB applications according to process and material can be categorized into two types: mirror aluminum and silver or gold plating. By using wire bonding & epoxy packaging then directly embedded on MCPCB, this practice can extend the lifespan of LED and unified light emission.
Compared to the traditional packing method, COB technology can directly mount multi-chip on the substrate, such as COB MCPCB. With this technique, we ca...
Model Number:pcba Base Material:ALU,FR4,CEM3 Copper Thickness:0.3-3oz Board Thickness:0.3-6mm Min. Hole Size:0.2mm Min. Line Width:3mil Min. Line Spacing:3mil Surface Finishing:HASL, OSP, Immersion Gold/Au, Immersion silver, etc.
Base Material:FR4, Copper Thickness:0.3-3oz Board Thickness:0.3-6mm Min. Hole Size:0.2mm Min. Line Width:3mil Min. Line Spacing:3mil Surface Finishing:HASL, OSP, Immersion Gold/Au, Immersion silver, etc.
Mobile:13326856492 Telephone:0755-84827607
Email:djtang25@qq.com