How to test the PCBA board?
How to test the PCBA board?
1. PCBA board manual test
Manual testing is to test directly by the vision and confirm the component mounting on PCB through vision and comparison. This technology is widely used. However, the large number and small components make this method more and more unsuitable. Moreover, some functional defects are not easy to be found, and the data is not easy to collect. In this way, more professional testing methods are needed.
2. PCBA board automatic optical inspection (AOI)
Automatic optical testing, also known as automatic visual testing, is carried out by a special tester. It is used before and after reflow and has a good effect on the polarity inspection of components. Easy-to-follow diagnosis is a common method, but this method is poor in short circuit identification.
3. PCBA board flying needle tester
Needle testing has been widely welcomed in the past few years due to advances in mechanical accuracy, speed, and reliability. In addition, the requirements for the test system with fast conversion and fixture-free capability required for prototype manufacturing and low-yield manufacturing make the flying needle test the best choice.
4. PCB Assembly board function test
This is the test method of a specific PCB or a specific unit, which is completed by special equipment. Functional tests mainly include final product tests and hot mock-up.
5. PCB Assembly manufacturing defect analyzer (MDA)
The main advantages of this test method are low initial cost, high output, easy-to-follow diagnosis, fast and complete short circuit, and open-circuit test. The disadvantage is that the function test cannot be carried out, there is usually no test coverage indication, the fixture must be used, and the test cost is high.
How are electronic components placed on PCB to form PCBA?
At present, the mainstream PCBA is assembled as SMT (surface mount technology). It will first print solder paste on the empty board, then paste the electronic components on the PCB, flow it through the reflow furnace, and paste the components on the PCB through solder paste welding.
A few PCBA assemblies requiring dip will adopt wave soldering technology. Generally speaking, there will be some heavy electronic components on the assembly board that need to be inserted and pulled by an external force. These components are not technically unable to be made into SMD components, or the price of SMD components does not meet market expectations or some components that must be inserted and pulled by external force when used by end customers, They will be designed as through-hole components, that is, dip, and then welded to PCB through wave soldering furnace.
At the same time, SMT and wave solving technology are mixed to achieve the design of component welding in PCBA.
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